IRF6655 Datasheet, PDF (3/10 Pages) International Rectifier – DirectFET Power MOSFET Typical values (unless otherwise specified)

Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
h Power Dissipation
h Power Dissipation
k Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
hl Junction-to-Ambient
il Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Case
Junction-to-PCB Mounted
IRF6655
Max.
2.2
1.4
42
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.4
Max.
58
–––
–––
3.0
–––
Units
W
°C
Units
°C/W
100
D = 0.50
10
1
0.1
0.01
1E-006
0.20
0.10
0.05
0.02
0.01
τ_{J τJ}
τ_{1 τ1}
R _{1R 1}
SINGLE PULSE
Ci= τi/Ri
Ci= τi/Ri
( THERMAL RESPONSE )
R _{2R 2}
τ_{2 τ2}
1E-005
0.0001
0.001
0.01
Ri (°C/W) τi (sec)
R _{3R 3}
R _{4R 4}
R_5R5
1.6195 0.000126
τ_{AτA 2.1406 0.001354}
τ_{3 τ3}
τ_{4 τ4}
τ_{5 τ5}
22.2887 0.375850
20.0457 7.410000
11.9144 99
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
† Surface mounted on 1 in. square Cu board, steady state.
‡ Used double sided cooling , mounting pad.
ˆ Mounted on minimum footprint full size board with metalized
‰ T_C measured with thermocouple incontact with top (Drain) of part.
Š R_θ is measured at T_J of approximately 90°C.
back and with small clip heatsink.
† Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
‡ Mounted to a PCB with a
thin gap filler and heat sink.
(still air)
ˆ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3