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ISL6556B Datasheet, PDF (9/24 Pages) Intersil Corporation – Optimized Multi-Phase PWM Controller with 6-Bit DAC and Programmable Internal Temperature Compensation for VR10.X Application
ISL6556B
Functional Pin Description
VCC - Supplies all the power necessary to operate the chip.
The controller starts to operate when the voltage on this pin
exceeds the rising POR threshold and shuts down when the
voltage on this pin drops below the falling POR threshold.
Connect this pin directly to a +5V supply or through a series
300Ω resistor to a +12V supply.
GND - Bias and reference ground for the IC.
EN - This pin is a threshold-sensitive enable input for the
controller. Connecting the 12V supply to EN through an
appropriate resistor divider provides a means to synchronize
power-up of the controller and the MOSFET driver ICs.
When EN is driven above 1.24V, the ISL6556B is active
depending on status of ENLL, the internal POR, and pending
fault states. Driving EN below 1.14V will clear all fault states
and prime the ISL6556 to soft-start when re-enabled.
ENLL - This pin is implemented in QFN ISL6556B only. It’s a
logic-level enable input for the controller. When asserted to a
logic high, the ISL6556B is active depending on status of
EN, the internal POR, VID inputs and pending fault states.
Deasserting ENLL will clear all fault states and prime the
ISL6556B to soft-start when re-enabled.
FS - A resistor, placed from FS to ground will set the switch-
ing frequency. There is an inverse relationship between the
value of the resistor and the switching frequency. See
Figure 13 and Equation 27.
VID4, VID3, VID2, VID1, VID0, and VID12.5 - These are the
inputs to the internal DAC that provides the reference voltage
for output regulation. Connect these pins either to open-drain
outputs with or without external pull-up resistors or to active-
pull-up outputs. VID4-VID12.5 have 50µA internal pull-up
current sources that diminish to zero as the voltage rises
above the logic-high level. These inputs can be pulled up as
high as VCC plus 0.3V.
VDIFF, VSEN, and RGND - VSEN and RGND form the
precision differential remote-sense amplifier. This amplifier
converts the differential voltage of the remote output to a
single-ended voltage referenced to local ground. VDIFF is
the amplifier’s output and the input to the regulation and
protection circuitry. Connect VSEN and RGND to the sense
pins of the remote load.
FB and COMP - Inverting input and output of the error
amplifier respectively. FB is connected to VDIFF through a
resistor. A negative current, proportional to output current is
present on the FB pin. A properly sized resistor between
VDIFF and FB sets the load line (droop). The droop scale
factor is set by the ratio of the ISEN resistors and the lower
MOSFET rDS(ON). COMP is tied back to FB through an
external R-C network to compensate the regulator.
REF - The REF input pin is the positive input of the Error
Amp. It is internally connected to DAC through a 1kΩ
resistor. A capacitor is used to between REF pin and ground
to smooth the voltage transition during Dynamic VID™
operations.
TCOMP - Temperature compensation scaling input. A
resistor from this pin to ground sets the temperature
compensation scales of internal thermal sense circuitry. The
sensed temperature is utilized to modify the droop current
output to FB to adjust for MOSFET rDS(ON) variations with
temperature.
PWM1, PWM2, PWM3, PWM4 - Pulse-width modulation
outputs. Connect these pins to the PWM input pins of the
Intersil driver IC. The number of active channels is
determined by the state of PWM3 and PWM4. Tie PWM3 to
VCC to configure for 2-phase operation. Tie PWM4 to VCC
to configure for 3-phase operation.
ISEN1, ISEN2, ISEN3, ISEN4 - Current sense inputs. The
ISEN1, ISEN2, ISEN3, and ISEN4 pins are held to a virtual
ground such that a resistor connected between them and the
drain terminal of the associated lower MOSFET will carry a
current proportional to the current flowing through the
related channel. The current is determined by the negative
voltage developed across the lower MOSFET’s rDS(ON)
which is the channel current scaled by the inverse of the
rDS(ON). The current is used as a reference for channel
balancing, protection, and load-line regulation (via the FB
pin). Inactive channels should have their respective current
sense inputs left open.
PGOOD - PGOOD is used as an indication of the end of
soft-start per the microprocessor specification. It is an open-
drain logic output that is low impedance until the soft-start is
completed. It will be pulled low again once the undervoltage
point is reached.
OFS - The OFS pin provides a means to program a dc
current for generating a offset voltage across the droop
resistor between FB and VDIFF. The offset current is
generated via an external resistor and precision internal
voltage references. The polarity of the offset is selected by
connecting the resistor to GND or VCC. For no offset, the
OFS pin should be left unterminated.
OFSOUT (ISL6556BCR only) - OFSOUT is the output of
the offset-current generating circuit. It must be connected to
FB to generate a dc offset.
OVP - Overvoltage protection pin. This pin pulls to VCC and
is latched when an overvoltage condition is detected.
Connect this pin to the gate of an SCR or MOSFET tied from
VIN or VOUT to ground to prevent damage to the load. This
pin may be pulled as high as 15V to ground with an external
resistor. However, it is only capable of pulling low when VCC
is above 2V.
9
FN9097.4
December 28, 2004