HCTS164MS_02 Datasheet, PDF (7/8 Pages) Intersil Corporation – Radiation Hardened 8-Bit Serial-In/Parallel-Out Shift Register

Die Characteristics
DIE DIMENSIONS:
95 mils x 95 mils
2.380mm x 2.410mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ±1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ±2.6kÅ
HCTS164MS
WORST CASE CURRENT DENSITY:
< 2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS164MS
DS2
DS1
VCC
Q7
Q6
(2)
(1)
(14)
(13)
(12)
Q0 (3)
Q1 (4)
NC
(11) Q5
NC
(10) Q4
(5)
(6)
(7)
(8)
Q2
Q3
GND
CP
7
(9)
(MR)
Spec Number 518613