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ISL12032 Datasheet, PDF (6/26 Pages) Intersil Corporation – Low Power RTC with Battery Backed SRAM and 50/60 Cycle AC Input and Xtal Back-up
ISL12032
I2C Interface Specifications Specifications apply for: VDD = 2.7V to 5.5V, TA = -40°C to +85°C, unless otherwise stated.
(Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
(Note 10) (Note 4) (Note 10) UNITS NOTES
tHIGH
Clock HIGH Time
Measured at the 70% of VDD
600
ns
crossing.
tSU:STA
tHD:STA
tSU:DAT
tHD:DAT
tSU:STO
tHD:STO
tDH
tR
tF
Cb
START Condition Setup Time
START Condition Hold Time
Input Data Setup Time
Input Data Hold Time
STOP Condition Setup Time
STOP Condition Hold Time
Output Data Hold Time
SDA and SCL Rise Time
SDA and SCL Fall Time
Capacitive loading of SDA or SCL
SCL rising edge to SDA
falling edge. Both crossing
70% of VDD.
From SDA falling edge
crossing 30% of VDD to SCL
falling edge crossing 70% of
VDD.
From SDA exiting the 30% to
70% of VDD window, to SCL
rising edge crossing 30% of
VDD.
From SCL falling edge
crossing 30% of VDD to SDA
entering the 30% to 70% of
VDD window.
From SCL rising edge
crossing 70% of VDD, to SDA
rising edge crossing 30% of
VDD.
From SDA rising edge to
SCL falling edge. Both
crossing 70% of VDD.
From SCL falling edge
crossing 30% of VDD, until
SDA enters the 30% to 70%
of VDD window.
From 30% to 70% of VDD.
From 70% to 30% of VDD.
Total on-chip and off-chip
600
600
100
0
600
600
0
20 + 0.1 x Cb
20 + 0.1 x Cb
10
ns
ns
ns
900
ns
ns
ns
ns
300
ns
7, 9
300
ns
7, 9
400
pF
7, 9
RPU
SDA and SCL Bus Pull-up Resistor Maximum is determined by
1
Off-chip
tR and tF.
For Cb = 400pF, max is about
2kΩ.
For Cb = 40pF, max is about
15kΩ
kΩ
7, 9
NOTES:
2. IRQ and FOUT Inactive.
3. VDD > VBAT +VBATHYS
4. Specified at TA =+25°C.
5. FSCL = 400kHz.
6. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
7. Parameter is not 100% tested.
8. VDD = 0V. IBAT increases at VDD voltages between 0.5V and 1.5V.
9. These are I2C specific parameters and are not tested, however, they are used to set conditions for testing devices to validate specification.
10. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.
6
FN6618.2
April 16, 2009