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ISL55112 Datasheet, PDF (4/20 Pages) Intersil Corporation – High-Speed Dual Precision CCD Driver
ISL55112
Absolute Maximum Ratings
Supply Voltage (VPLUS and VSUB) . . . . . . . . . . . . . . . 9.0V
Supply Voltage (H1_VP/H2_VP/RG_VP/HL_VP - H1_VN/
H2_VN/RG_VN/HL_VN) . . . . . . . . . . . . . . . . . . . . . 9.0V
Supply Voltage (VDD VLOGIC) . . . . . . . . . . . . -0.3V to 6.0V
Maximum Output Current H1-H2 . . . . . . . . . . . . . . 200mA
Maximum Output Current RG/HL . . . . . . . . . . . . . . . 20mA
Input Voltages
H1/H2/RG/HL/EN/PD . . . . . (GND -0.5V) to (VLogic +0.5V)
Output Voltages
H1/H2//RG/HL . . . . . . . . . . . . . (VN -0.5V) to (VP +0.5V)
LATCH-UP . . . . . . . . . . . . . . . . . Class II, Level A AT +85°C
ESD Ratings
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . 3kV
Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . 300V
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
24 Ld QFN Package (Notes 4, 5) . . 37
1.5
Maximum Junction Temperature (Plastic Package). . . +150°C
Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature. . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features and is based on 6 Thermal Vias. See Tech Brief TB379 for details. Adding additional vias can improve thermal
performance. See Tech Brief TB389.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Recommended Operating Specifications Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
MAX
(°C) (Note 6) TYP (Note 6) UNITS
Driver Positive Supply
VPn H1, H2, RG, HL
Full
-2.5
8.0
V
Driver Negative Supply
VNn H1, H2, RG, HL
Full
-8.0
2.5
V
Driver Differential Supply Range VPn-VNn H1, H2, RG, HL
Full
5.5
8.0
V
Logic Positive Supply Voltage
VDD
Full
2.7
5.5
V
NOTE: VPLUS must be connected to most positive Driver Voltage Rail, VSUB must be connected to the most negative voltage rail.
VSUB should be connected to ground where Driver Negative Supplies are above ground. H1_VN and H2_VN should be connected
to each other and operated at the same voltage.
Electrical Specifications
Test Conditions: XX_VP = 4V, XX_VN = -4V, VDD = 3.3V, VPLUS = 4V, VSUB = -4V,
ROIC = 68kΩ; Unless Otherwise specified. Full (-40°C to +85°C) limits are established by
characterization and are not production tested. Boldface limits apply over the operating
temperature range, -40°C to +85°C.
SYMBOL
PARAMETER
TEST CONDITIONS
(Note 8)
TEMP
MIN
(°C) (Note 6)
TYP
MAX
(Note 6) UNITS
LOGIC INPUT CHARACTERISTICS H1/H2/RG/HL DRIVER INPUTS
VIH Input High Threshold Voltage H1, H2, RG, VDD = 3.3V
25
2.0
V
HL (Note 10)
Full
2.0
V
VIL Input Low Threshold Voltage H1, H2, RG, VDD = 3.3V
25
HL (Note 10)
Full
1.2
V
1.2
V
IIH
Logic “1” Input Current
H1, H2, RG, VINPUT = 5.5V,
25
56
63
µA
HL
VDD = 5.5V
Full
45
65
µA
IIL
Logic “0” Input Current
H1, H2, RG, VINPUT = 0.0V,
25
HL
VDD = 5.5V
Full
30
175
nA
200
nA
CIN Input Capacitance (Gnd)
RIN Input Resistance (Gnd)
H1, H2, RG, HL
H1, H2, RG, HL
25
3.5
pF
25
100k
Ω
4
FN6649.0
September 23, 2009