ISL55112 Datasheet, PDF (14/20 Pages) Intersil Corporation – High-Speed Dual Precision CCD Driver

ISL55112
Important Note: The ISL55112 exposed pad is used for heat sinking of the device. It must be electrically
connected to the most negative supply potential needed for driver output (V_SUB). Therefore, when
negative drive rails are used, the thermal pad (V_SUB) must be isolated from ground.
Typical Performance Curves
VDD = 3.3V, VH = 4V, VN = -4V, R_OIC = 68kΩ, C_L= 300pF for
H1/2OUT, C_L = 22pF for RG/HLOUT, Unless specified otherwise. Refer
to Figures 1, 2 and 3. (Information derived from ISL55112 Evaluation
board characterization. See AN1495 ISL55112 Evaluation Board).
3.4
I_OUT = -100mA
3.2
+85°C
3.0
+25°C
2.8
2.6
-40°C
2.4
2.2 ₄
5
6
7
8
V_H, DRIVE RAIL (V)
FIGURE 7. H1/H2 DRIVER SOURCE RESISTANCE vs
VH
29
I_OUT = -10mA
28
27
26
+85°C
25
24
23
+25°C
22
21
-40°C
20
194.5
5.5
6.5
7.5 8.0
V_H, DRIVE RAIL (V)
FIGURE 9. RG/HL DRIVER SOURCE RESISTANCE vs
VH
2.5
I_OUT= +100mA
2.4
2.3
+85°C
2.2
2.1
+25°C
2.0
1.9
1.8
-40°C
1.7
1.6
1.5 ₄
5
6
7
8
V_H, DRIVE RAIL (V)
FIGURE 8. H1/H2 DRIVER SINK RESISTANCE VS VH
20
+85°C
I_OUT = +10mA
19
18
17
+25°C
16
15
-40°C
14
4.5
5.5
6.5
V_H, DRIVE RAIL (V)
7.5 8.0
FIGURE 10. RG/HL DRIVER SINK RESISTANCE vs VH
14
FN6649.0
September 23, 2009