ISL23418 Datasheet, PDF (3/20 Pages) Intersil Corporation – Single, 128-Tap, Low Voltage Digitally Controlled Potentiometer (XDCP™)

ISL23418
Ordering Information
PART NUMBER
(Note 5)
PART
MARKING
RESISTANCE
OPTION
(kΩ)
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL23418TFUZ (Notes 1, 3)
3418T
100
-40 to +125 10 Ld MSOP
M10.118
ISL23418UFUZ (Notes 1, 3)
3418U
50
-40 to +125 10 Ld MSOP
M10.118
ISL23418WFUZ (Notes 1, 3)
3418W
10
-40 to +125 10 Ld MSOP
M10.118
ISL23418TFRUZ-T7A (Notes 2, 4)
HL
100
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23418TFRUZ-TK (Notes 2, 4)
HL
100
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23418UFRUZ-T7A (Notes 2, 4)
HK
50
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23418UFRUZ-TK (Notes 2, 4)
HK
50
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23418WFRUZ-T7A (Notes 2, 4)
HJ
10
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23418WFRUZ-TK (Notes 2, 4)
HJ
10
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. Please refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate -
e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
5. For Moisture Sensitivity Level (MSL), please see device information page for ISL23418. For more information on MSL please see Tech Brief TB363.
3
FN7901.0
August 3, 2011