ISL1218 Datasheet, PDF (3/21 Pages) Intersil Corporation – Low Power RTC with Battery Backed SRAM

ISL1218
Absolute Maximum Ratings
Voltage on V_DD, V_BAT, SCL, SDA, and IRQ/F_OUT Pins
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Voltage on X1 and X2 Pins
(respect to ground) . . . . . . . . . . . .-0.5V to V_DD + 0.5 (V_DD Mode)
-0.5V to V_BAT + 0.5 (V_BAT Mode)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . .>2kV
ESD Rating (Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . .>175V
Thermal Information
Thermal Resistance (Typical, Note 1)
θ_JA (°C/W)
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
130
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
110
Moisture Sensitivity for MSOP Package
(see Technical Brief TB363). . . . . . . . . . . . . . . . . . . . . . . . Level 2
Moisture Sensitivity for SOIC Package
(see Technical Brief TB363). . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package). . . . . . . . . 150°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
TYP
MIN (Note 5)
V_DD
V_BAT
I_DD1
I_DD2
I_DD3
I_BAT
I_BATLKG
I_LI
I_LO
V_TRIP
V_TRIPHYS
V_BATHYS
IRQ/F_OUT
V_OL
I_LO
Main Power Supply
Battery Supply Voltage
Supply Current
Supply Current With I²C Active
Supply Current (Low Power Mode)
Battery Supply Current
Battery Input Leakage
Input Leakage Current on SCL
I/O Leakage Current on SDA
V_BAT Mode Threshold
V_TRIP Hysteresis
V_BAT Hysteresis
V_DD = 5V
V_DD = 3V
V_DD = 5V
V_DD = 5V, LPMODE = 1
V_BAT = 3V
V_DD = 5.5V, V_BAT = 1.8V
Output Low Voltage
Output Leakage Current
V_DD = 5V, I_OL = 3mA
V_DD = 2.7V, I_OL = 1mA
V_DD = 5.5V
V_OUT = 5.5V
2.7
1.8
2
1.2
40
1.4
400
100
100
1.6
2.2
10
35
10
50
100
MAX
5.5
5.5
6
4
120
5
950
100
2.64
60
100
0.4
0.4
400
UNITS
V
V
µA
µA
µA
µA
nA
nA
nA
nA
V
mV
mV
V
V
nA
NOTES
2, 3
2, 3
2, 7
2
Power-Down Timing Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
V_{DD SR-}
PARAMETER
V_DD Negative Slewrate
CONDITIONS
TYP
MIN (Note 5) MAX
10
UNITS
V/ms
NOTES
4
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
SERIAL INTERFACE SPECS
V_IL
SDA and SCL Input Buffer LOW
Voltage
V_IH
SDA and SCL Input Buffer HIGH
Voltage
TEST CONDITIONS
TYP
MIN (Note 5) MAX
-0.3
0.7 x
V_DD
0.3 x
V_DD
V_DD +
0.3
UNITS NOTES
V
V
3
FN6313.0
June 22, 2006