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IRFP9150 Datasheet, PDF (3/7 Pages) Intersil Corporation – 25A, 100V, 0.150 Ohm, P-Channel Power MOSFET
IRFP9150
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
Continuous Source to Drain Current
Pulse Source to Drain Current
(Note 3)
ISD
ISDM
Modified MOSFET Symbol
Showing the Integral Re-
verse P-N Junction Diode
G
MIN TYP MAX UNITS
-
-
-25
A
D
-
-
-100
A
S
Source to Drain Diode Voltage (Note 2)
Reverse Recovery Time
Reverse Recovered Charge
VSD
trr
QRR
TJ = 25oC, ISD = -25A, VGS = 0V (Figure 13)
TJ = 25oC, ISD = -25A, dISD/dt = 100A/µs
TJ = 25oC, ISD = -25A, dISD/dt = 100A/µs
-
-0.9 -1.5
V
-
150 300
ns
0.3 0.7 1.5
µC
NOTES:
2. Pulse test: pulse width ≤ 300µs, duty cycle ≤ 2%.
3. Repetitive Rating: Pulse width limited by Maximum junction temperature. See Transient Thermal Impedance curve (Figure 3
4. VDD = 25V, start TJ = 25oC, L = 3.2mH, RG = 25Ω, peak IAS = 25A (Figures 15, 16).
Typical Performance Curves Unless Otherwise Specified
1.2
1.0
0.8
0.6
0.4
0.2
0
0
50
100
150
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs
CASE TEMPERATURE
-30
-25
-20
-15
-10
-5
0
25
50
75
100
125
150
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
10
DUTY CYCLE IN DESCENDING ORDER
0.5
0.2
0.1
0.05
1
0.02
0.01
0.10
SINGLE PULSE
0.01
10-5
10-4
10-3
10-2
10-1
t1, SQUARE WAVE PULSE DURATION (s)
PDM
NOTES:
t1
t2
DUTY FACTOR: D = t1/t2
TJ = PDM x ZθJC x RθJC + TC
1
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
4-65