ISL71840SEH Datasheet, PDF (24/27 Pages) Intersil Corporation – Radiation Hardened 30V 16-Channel Analog

ISL71840SEH
Die Characteristics
Die Dimensions
2820µm x 4080µm (111 mils x 161 mils)
Thickness: 483µm ±25µm (19 mils ±1 mil)
Interface Materials
GLASSIVATION
Type: 12kÅ Silicon Nitride on 3kÅ Oxide
TOP METALLIZATION
Type: 300Å TiN on 2.8µm AlCu
In Bondpads, TiN has been removed.
BACKSIDE FINISH
Silicon
PROCESS
P6SOI
Metalization Mask Layout
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
Additional Information
WORST CASE CURRENT DENSITY
1.6 x 10⁵ A/cm²
TRANSISTOR COUNT
5682
Weight of Packaged Device
2.096 grams
Lid Characteristics
Finish: Gold
Potential: Grounded, tied to package pin 12
IN16
V+
OUT
V-
IN8
IN15
IN7
IN14
IN6
IN13
IN5
IN12
IN4
IN11
IN3
IN10
IN2
IN9
IN1
EN
A4
A3
A2
A1
A0
BAR
GND
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FN8734.3
June 9, 2016