ISL70444SEH Datasheet, PDF (23/23 Pages) Intersil Corporation – 19MHz Rad Hard 40V Quad Rail-to-Rail Input-Output, Low-Power Operational Amplifiers

ISL70444SEH
Package Outline Drawing
K14.C
14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
Rev 0, 9/12
0.050 (1.27 BSC)
PIN NO. 1
ID AREA
1
A
A
0.390 (9.91)
0.376 (9.55)
0.022 (0.56)
0.015 (0.38)
TOP VIEW
0.115 (2.92)
0.085 (2.16)
0.045 (1.14)
0.026 (0.66) ⁵
0.260 (6.60)
0.248 (6.30)
-C-
SEATING AND
BASE PLANE
BOTTOM
METAL
6
0.183 (4.65)
0.167 (4.24)
SIDE VIEW
0.005 (0.13)
MIN
3
0.009 (0.23)
0.004 (0.10)
-D-
-H-
0.370 (9.40)
0.270 (6.86)
0.03 (0.76) MIN
BOTTOM METAL
0.005 (0.127) REF.
OFFSET FROM
CERAMIC EDGE
OPTIONAL
PIN 1 INDEX
0.006 (0.15)
0.004 (0.10)
LEAD FINISH
BASE
METAL
0.019 (0.48)
0.015 (0.38)
0.0015 (0.04)
MAX
0.022 (0.56)
0.015 (0.38)
SECTION A-A
0.009 (0.23)
0.004 (0.10)
2
BOTTOM VIEW
NOTES:
1. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area shown.
The manufacturer’s identification shall not be used as a pin one
identification mark.
2. The maximum limits of lead dimensions (section A-A) shall be
measured at the centroid of the finished lead surfaces, when solder
dip or tin plate lead finish is applied.
3. Measure dimension at all four corners.
4. For bottom-brazed lead packages, no organic or polymeric materials
shall be molded to the bottom of the package to cover the leads.
5. Dimension shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension minimum shall
be reduced by 0.0015 inch (0.038mm) maximum when solder dip
lead finish is applied.
6. The bottom of the package is a solderable metal surface.
7. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
8. Dimensions: INCH (mm). Controlling dimension: INCH.
23
FN8411.1
June 14, 2013