ISL70444SEH Datasheet, PDF (21/23 Pages) Intersil Corporation – 19MHz Rad Hard 40V Quad Rail-to-Rail Input-Output, Low-Power Operational Amplifiers

ISL70444SEH
Die Characteristics
Die Dimensions
2410µm x 3175µm (80mils x 101mils)
Thickness: 483µm ± 25µm (19mils ± 1 mil)
Interface Materials
GLASSIVATION
Type: Nitrox
Thickness: 15kÅ
TOP METALLIZATION
Type: AlCu (99.5%/0.5%)
Thickness: 30kÅ
BACKSIDE FINISH
Silicon
PROCESS
PR40
Metallization Mask Layout
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
ADDITIONAL INFORMATION
WORST CASE CURRENT DENSITY
< 2 x 10⁵ A/cm²
TRANSISTOR COUNT
730
Weight of Packaged Device
0. 5952 Grams (Typical)
Lid Characteristics
Finish: Gold
Potential: Unbiased, tied to E-pad under package
Case Isolation to Any Lead: 20 x 10⁹ Ω (min)
21
FN8411.1
June 14, 2013