D2-24044 Datasheet, PDF (20/20 Pages) Intersil Corporation – Digital Audio Amplifier Power Stage

D2-24044
Package Outline Drawing
M38.173C
38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP)
Rev 0, 4/10
B
PIN 1 ID
D
32 1
0.09-0.20
12 3
4.6±0.10
A
TOP VIEW
6.4
CL
4.4±0.10
4
38
0.20 C A-B D
2X N/2 TIPS
0.17-0.27 0.08 M C A-B D 5
SEE
DETAIL "A"
END VIEW
3.20±0.10
EXPOSED PAD VIEW
(14°) TYP
0.05 C
0.50
4
9.70±0.10
SIDE VIEW
1.10 MAX
0.90±0.05
C
0.05/0.15
0.10 C
SEATING
PLANE
(1.00)
0.25
(0-8°)
0.6±0.10
DETAIL "A"
SCALE: 30/1
(VIEW ROTATED 90°C.W.)
PARTING
LINE
H3
(5.80)
(4.60)
(1.30)
(3.20)
(36X 0.50)
(38X 0.28)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Die thickness allowable is 0.279±0.0127 (0.0110±0.0005 inches).
2. Dimensioning & tolerances per ASME. Y14.5m-1994.
3. Datum plane H located at mold parting line and coincident
with lead where lead exits plastic body at bottom of parting line.
4. At reference datum and does not include mold flash or protrusions,
and is measured at the bottom parting line. Mold flash or protrusions
shall not exceed 0.15mm on the package ends and 0.25mm between
the leads.
5. The lead width dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.07mm total in excess of
the lead width dimension at maximum material condition. Dambar
cannot be located on the lower radius or the foot. Minimum space
between protrusions and an adjacent lead should be 0.08mm.
6. This part is compliant with JEDEC specification MO-153 variation BDT-1
20
FN7678.0
September 3, 2010