X9261 Datasheet, PDF (2/21 Pages) Intersil Corporation – Single Supply/Low Power/256-Tap/SPI Bus

X9261
Ordering Information
PART NUMBER
X9261TS24*
PART MARKING V_CC LIMITS (V)
5 ±10%
R_TOTAL (kΩ)
100
TEMP RANGE (°C)
PACKAGE
0 to 70
24 Ld SOIC (300 mil)
X9261TS24Z (Note)
X9261TS Z
0 to 70
24 Ld SOIC (300 mil) (Pb-free)
X9261TS24I*
-40 to 85
24 Ld SOIC (300 mil)
X9261TV24
X9261TV
0 to 70
24 Ld TSSOP (4.4mm)
X9261TV24Z (Note)
X9261TV Z
0 to 70
24 Ld TSSOP (4.4mm) (Pb-free)
X9261TV24I
X9261TV I
-40 to 85
24 Ld TSSOP (4.4mm)
X9261TV24IZ (Note)
X9261TV Z I
-40 to 85
24 Ld TSSOP (4.4mm) (Pb-free)
X9261US24*
50
0 to 70
24 Ld SOIC (300 mil)
X9261US24I*
-40 to 85
24 Ld SOIC (300 mil)
X9261UV24*
X9261UV
0 to 70
24 Ld TSSOP (4.4mm)
X9261UV24Z* (Note)
X9261UV Z
0 to 70
24 Ld TSSOP (4.4mm) (Pb-free)
X9261UV24I
X9261UV I
-40 to 85
24 Ld TSSOP (4.4mm)
X9261UV24IZ (Note)
X9261UV Z I
-40 to 85
24 Ld TSSOP (4.4mm) (Pb-free)
X9261TS24-2.7*
2.7-5.5
100
0 to 70
24 Ld SOIC (300 mil)
X9261TS24I-2.7*
-40 to 85
24 Ld SOIC (300 mil)
X9261TV24-2.7
X9261TV F
0 to 70
24 Ld TSSOP (4.4mm)
X9261TV24Z-2.7 (Note) X9261TV Z F
0 to 70
24 Ld TSSOP (4.4mm) (Pb-free)
X9261US24-2.7*
50
0 to 70
24 Ld SOIC (300 mil)
X9261US24I-2.7*
-40 to 85
24 Ld SOIC (300 mil)
X9261UV24-2.7*
X9261UV F
0 to 70
24 Ld TSSOP (4.4mm)
X9261UV24Z-2.7* (Note) X9261UV Z F
0 to 70
24 Ld TSSOP (4.4mm) (Pb-free)
X9261UV24I-2.7*
X9261UV G
-40 to 85
24 Ld TSSOP (4.4mm)
X9261UV24IZ-2.7* (Note) X9261UV Z G
-40 to 85
24 Ld TSSOP (4.4mm) (Pb-free)
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2
FN8171.2
September 14, 2005