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| ISL71831SEH Datasheet, PDF (18/21 Pages) Intersil Corporation – Radiation Hardened 5V 32-Channel Analog Multiplexer | |||
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ISL71831SEH
Die Characteristics
Die Dimensions
3102µm x 2800µm (122.1260 mils x 110.2362 mils)
Thickness: 483µm ±25µm (19 mils ±1 mil)
Interface Materials
GLASSIVATION
Type: 12kÃ
Silicon Nitride on 3kÃ
Oxide
TOP METALLIZATION
Type: 300Ã
TiN on 2.8µm AlCu
In Bondpads, TiN has been removed.
BACKSIDE FINISH
Silicon
PROCESS
P6SOI
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
Additional Information
WORST CASE CURRENT DENSITY
1.6 x 105 A/cm2
TRANSISTOR COUNT
7734
Weight of Packaged Device
1.522 grams
Lid Characteristics
Finish: Gold
Potential: Grounded, tied to package pin 29
Metalization Mask Layout
IN12
IN13 IN14
IN15 IN16
OUT
IN32 IN31 IN30 IN29
IN28
IN11
IN27
IN10
IN26
IN09
IN25
IN08
IN24
IN07
IN23
IN06
IN22
IN05
IN21
IN04
IN20
IN03
IN19
IN02
IN18
IN01
V+
VREF
A0
A1
A2
A3
A4
EN
GND
IN17
Submit Document Feedback 18
FN8759.2
November 18, 2016
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