ISL5239 Datasheet, PDF (15/31 Pages) Intersil Corporation – Pre-Distortion Linearizer

ISL5239
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . +2.5VCCC, 4.6V VCCIO
Input, Output or I/O Voltage . . . . . . . . . . . . . . . . . GND -0.5V to 5.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Operating Conditions
Voltage Range Core, V_CCC . . . . . . . . . . . . . . . . . . +1.71V to +1.89V
Voltage Range I/O, V_{CCCIO (Note 3)} . . . . . . . . . +3.135V to +3.465V
Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40^oC to 85^oC
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V_CC
Thermal Information
Thermal Resistance (Typical, Notes 1, 2)
θ_JA (^oC/W)
196 BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . .
42
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
38
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
36
Maximum Storage Temperature Range . . . . . . . . . . -65^oC to 150^oC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 125^oC
For Recommended Soldering Conditions, See Tech Brief TB334.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board. See Tech Brief TB379.
2. With “direct attach” features (i.e., vias in the PCB), the thermal resistance is 36 without airflow, w/200 it is 33, w/400 it is 31^oC/W. Tie 196 BGA
package pins F6-9, G6-9, H6-9, J6-9 to heat sink or ground with vias to ensure maximum device heat dissipation.
3. Single supply operation of both the core VCCC and I/O VCCIO at 1.8V is not allowed.
DC Electrical Specifications V_CCC = 1.8± 5%, V_CCIO = 3.3 ±5%, T_A = -40^oC to 85^oC
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Typ
MAX
UNITS
Logical One Input Voltage
Logical Zero Input Voltage
Clock Input High
Clock Input Low
Output High Voltage
Output Low Voltage
Input Leakage Current
Output Leakage Current
Input Pull-up Leakage Current Low
Input Pull-up Leakage Current High
Standby Power Supply Current
V_IH
V_IL
V_IHC
V_ILC
V_OH
V_OL
I_L
I_H
I_SL
I_SH
I_CCSB
V_CCC = 1.89V, V_CCIO = 3.465V
V_CCC = 1.71V, V_CCIO = 3.135V
V_CCC = 1.89V, V_CCIO = 3.465V
V_CCC = 1.71V, V_CCIO = 3.135V
I_OH = -2mA, V_CCC = 1.71V, V_CCIO = 3.135V
I_OL = 2mA, V_CCC = 1.71V, V_CCIO = 3.135V
V_IN = V_CCIO or GND, V_CCC = 1.89V,
V_CCIO = 3.465V
V_IN = V_CCIO or GND, V_CCC = 1.89V,
V_CCIO = 3.465V
V_IN = V_CCIO or GND, V_CCC = 1.89V,
V_CCIO = 3.465V, TMS, TRST, TDI
V_IN = V_CCIO or GND, V_CCC = 1.89V,
V_CCIO = 3.465V, TMS, TRST, TDI
V_CCC = 1.89V, V_CCIO = 3.465V, Outputs Not
Loaded
2.0
-
-
0.8
2.0
-
-
0.8
2.6 V_CC-0.2
-
0.2
0.4
-10
1
10
-10
1
10
-100
-50
-
-
1
10
-
1
3
100
500
V
V
V
V
V
V
µA
µA
µA
µA
mA(core)
uA(I/O)
Operating Power Supply Current
I_CCOP f = 125MHz, V_IN = V_CCIO or GND,
-
V_CCIO = 3.465V, V_CCC = 1.89V,
300 mA (Core)
100
mA(I/O),
(Note 4)
Input Capacitance
C_IN
Freq = 1MHz, V_CCIO Open, All Measurements
-
Are Referenced to Device Ground
5
pF (Note 5)
Output Capacitance
C_OUT Freq = 1MHz, V_CCIO Open, All Measurements
-
are Referenced to Device Ground
5
pF (Note 5)
NOTES:
4. Power Supply current is proportional to operation frequency. Typical rating for I_CCOP is 2.0 mA/MHz (core) and 0.5mA/MHz(I/O),
5. Capacitance T_A = 25^oC, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
process or design changes.
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