HMU16JC-35 Datasheet, PDF (13/13 Pages) Intersil Corporation – 16 x 16-Bit CMOS Parallel Multipliers

HMU16, HMU17
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
0.004 (0.10) C
0.025 (0.64) _R
0.045 (1.14)
CL
E1 E
D2/E2
D2/E2
VIEW “A”
0.020 (0.51) MAX
3 PLCS
D1
D
0.026 (0.66)
0.032 (0.81)
0.020 (0.51)
MIN
A1
A
-C-
SEATING
PLANE
0.013 (0.33)
0.021 (0.53)
N68.95 (JEDEC MS-018AE ISSUE A)
68 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.165 0.180 4.20
4.57
-
A1
0.090 0.120 2.29
3.04
-
D
0.985 0.995 25.02 25.27
-
D1
0.950 0.958 24.13 24.33
3
D2
0.441 0.469 11.21 11.91
4, 5
E
0.985 0.995 25.02 25.27
-
E1
0.950 0.958 24.13 24.33
3
E2
0.441 0.469 11.21 11.91
4, 5
N
68
68
6
Rev. 2 11/97
0.045 (1.14)
MIN
0.025 (0.64)
MIN
VIEW “A” TYP.
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
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