ISL78840ASEH Datasheet, PDF (12/15 Pages) Intersil Corporation – Radiation Hardened, High Performance Industry Standard Single-Ended Current Mode PWM Controller

ISL78840ASEH, ISL78841ASEH, ISL78843ASEH, ISL78845ASEH
Package Characteristics
Weight of Packaged Device
8 Ld Mini DIP: 0.7004 Grams
8 Ld Flatpack: 0.3605 Grams
Die Characteristics
Die Dimensions
2030µm x 2030µm (80 mils x 80 mils)
Thickness: 482µm ± 25.4µm (19.0 mils ± 1 mil)
Interface Materials
GLASSIVATION
Type: Silicon Oxide and Silicon Nitride
Thickness: 0.3µm ± 0.03µm to 1.2µm ± 0.12µm
TOP METALLIZATION
Type: AlCu (99.5%/0.5%)
Thickness: 2.7µm ±0.4µm
SUBSTRATE
Silicon
BACKSIDE FINISH
Silicon
PROCESS
0.6µM BiCMOS Junction Isolated
ASSEMBLY RELATED INFORMATION
Substrate Potential
Unbiased
ADDITIONAL INFORMATION
Worst Case Current Density
< 2 x 10⁵ A/cm²
Transistor Count
1278
Die Map
12
FN7952.0
May 29, 2012