251748-007 Datasheet, PDF (82/102 Pages) Intel Corporation – Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package

Thermal Specifications and Design Considerations
6.1
6.1.1
Processor Thermal Specifications
The Celeron processor 0.13 micron process requires a thermal solution to maintain temperatures
within the operating limits as set forth in Section 6.1.1. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and potentially
other components in the system. As processor technology changes, thermal management becomes
increasingly crucial when building computer systems. Maintaining the proper thermal environment
is key to reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component-level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to Intel^® Pentium^® 4
Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guide.
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (T_C) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 37. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 37 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 7.3. To ensure maximum flexibility
for future requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases,
the Thermal Monitor feature must be enabled for the processor to remain within
specification.
Multiple VID processors will be shipped either at VID=1.475 V, VID=1.500 V, or VID=1.525 V.
Processors with multiple VIDs have TDP _max of the highest VID for the specified frequency. For
example, for the processors through 2.40 GHz, the TDP would be 59.8 W.
82
Intel^® Celeron^® Processor on 0.13 Micron Process in the 478-Pin Package Datasheet