251748-007 Datasheet, PDF (53/102 Pages) Intel Corporation – Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package

Package Mechanical Specifications
Figure 29 shows the keep-in specification for pin-side components. The Celeron processor on
0.13 micron process may contain pin side capacitors mounted to the processor package.
Figure 31 shows the flatness and tilt specifications for the IHS. Tilt is measured with the reference
datum set to the bottom of the processor substrate.
Figure 29. Processor Cross-Section and Keep-In
FCPGA 2
IHS
Substrate
Socket must allow clearance
for pin shoulders and mate
flush with this surface
13.97m m
Component Keepin
1.25mm
Figure 30. Processor Pin Detail
Ø 0.65 MAX
PINHEAD DIAMETER
Ø 0.305±0.025
Ø 1.032 MAX
KEEP OUT ZONE
ALL DIMENSIONS ARE IN MILIMETERS
2.03±0.08
NOTES:
1. Pin plating consists of 0.2 micrometers Au over 2.0 micrometer Ni.
2. 0.254 mm diametric true position, pin-to-pin.
0.3 MAX
SOLDER FILLET HEIGHT
Intel^® Celeron^® Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
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