DG33FB Datasheet, PDF (7/88 Pages) Intel Corporation – Technical Product Specification

Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 75
5.1.1 Safety Standards.................................................................. 75
5.1.2 European Union Declaration of Conformity Statement ................ 76
5.1.3 Product Ecology Statements................................................... 78
5.1.4 EMC Regulations .................................................................. 82
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel Configuration and DIMM Configuration........................ 18
4. Back Panel Audio Connector Options .................................................. 25
5. LAN Connector LED Locations ............................................................ 27
6. Thermal Sensors and Fan Headers ..................................................... 29
7. Location of the Standby Power Indicator LED ....................................... 36
8. Detailed System Memory Address Map ............................................... 38
9. Back Panel Connectors ..................................................................... 41
10. Component-side Connectors and Headers ........................................... 42
11. Connection Diagram for Front Panel Header ........................................ 47
12. Connection Diagram for Front Panel USB Headers ................................ 49
13. Location of the Jumper Block............................................................. 50
14. Board Dimensions ........................................................................... 51
15. Localized High Temperature Zones..................................................... 55
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. Audio Jack Support .......................................................................... 24
5. LAN Connector LED States ................................................................ 27
6. Effects of Pressing the Power Switch .................................................. 30
7. Power States and Targeted System Power........................................... 31
8. Wake-up Devices and Events ............................................................ 32
9. System Memory Map ....................................................................... 39
10. Component-side Connectors and Headers Shown in Figure 10................ 43
11. Serial ATA Connectors ...................................................................... 44
12. Chassis Intrusion Header .................................................................. 44
13. Serial Port Header ........................................................................... 44
14. Front and Rear Chassis Fan Headers .................................................. 44
15. Processor Fan Header ...................................................................... 44
16. Front Panel Audio Header ................................................................. 45
17. Auxiliary Front Panel Power/Sleep LED Header..................................... 45
18. Processor Core Power Connector........................................................ 46
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