DG33FB Datasheet, PDF (56/88 Pages) Intel Corporation – Technical Product Specification

Intel Desktop Board DG33FB Technical Product Specification
Table 27 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 27. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G33 GMCH
Intel 82801IH (ICH9DH)
97 ^oC (under bias)
92 ^oC (under bias)
For information about
Processor datasheets and specification updates
Refer to
Section 1.2, page 15
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG33FB
MTBF is 134,638 hours.
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