PTFB072707FH Datasheet, PDF (9/10 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FET

PTFB072707FH
Package Outline Specifications
Package H-34288G-4/2
D 45° x .64
[.025]
2X
30.0°
4X 3.49±0.51
[.138±.020]
V
21.72
[.855]
CL
D
V
1.98
[.078]
2X 2.29
[.090]
9.78
CL
[.385]
CL
9.40
[.370]
16.76±0.51
[.660±.020]
4X R0.51+-..1338
[^{R.020+-..000155} ]
4.04+-00.1.235
[^{.159+-.0.00150} ]
SPH 1.57
[.062]
G
CL
2X 17.75
[.699]
22.35±0.20
[.880±.008]
H-34288G-4/2_sl_po_03_08-08-2013
1.02
[.040]

S
23.11
[.910]
Diagram Notes—unless otherwise specified:
Diag₁ra_. m_InN_teo_rte_ps_re—_{t d}u_in_mle_es_ns_so_iot_nh_ser_aw_nis_de_tos_lp_ee_rac_nif_cie_ed_s: _{per ASME Y14.5M-1994.}
2¹. ^. P^Irⁿim^tea^rpry^red^tim^dimen^esⁿio^sn^iosⁿa^sr^aeⁿm^dm^to.^leA^rl^ateⁿr^cn^ea^ste^ped^rim^Ae^Sn^Msi^Eon^Ys¹a⁴r^.e^5Min^-c¹h⁹e⁹s⁴.^.
3². ^. A^Pll^rtⁱo^mle^ar^ra^yn^dcⁱe^ms^e±^ns0ⁱ.^o1ⁿ2^s7^a[.^r0^e0^m5]^mu^;n^ale^lts^es^rns^ap^teec^difⁱi^med^eno^sth^ioeⁿr^sw^ais^re^e. ^inches.
4³. ^. P^Ain^lls^t:^oD^le–^radⁿr^ca^ein^s;^±G⁰–^.1g²a⁷te^[.;⁰S⁰⁵–^].source; V – V_DD.
5⁴. ^. L^Peaⁱⁿd^s:th^Dic^-kn^de^rasⁱsⁿ:^;0^G.1^-0^g+^at0^e.^;0^S51^(f/^l-^a0ⁿ.0^g2^e5^{) -}m^sm^ou[^r.^c0^e0^;5^V+^-0^V.0^D0^D2^./-0.001 inch].
6⁵. ^. G^Lo^eld^adpl^ta^htⁱi^cn^kgⁿt^eh^sic^sk^: n⁰e^.1s⁰s:⁺0⁰.2^.05⁵m^1/ic^–r⁰o^.n⁰²[1⁵0^[.m⁰⁰ic⁵ro⁺i^.n⁰c⁰h²]^/–m^.0a⁰x¹. ^].
6. Gold plating thickness: 0.25 micron [10 microinch] max.
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http://www.infineon.com/rfpower
Data Sheet
9 of 10
Rev. 02.1, 2016-06-15