XC167CS-32F Datasheet, PDF (88/90 Pages) Infineon Technologies AG – 16-Bit Single-Chip Microcontroller with C166SV2 Core

5
Package and Reliability
5.1
Packaging
Table 24 Package Parameters (P-TQFP-144-19)
Parameter
Symbol
Limit Values
Min.
Max.
Power dissipation
P_DISS
–
0.8
Thermal resistance
R_THA
–
32
Package Outlines
XC167-32
Derivatives
Package and Reliability
Unit Notes
W
–
K/W Chip-Ambient
0.5
0.22 ^{±0.05 2)}
H
17.5
C
0.08
0.08 ^M A-B D C 144x
22
20 ¹⁾
D
0.2 A-B D 144x
0.2 A-B D H 4x
0.6 ±0.15
A
B
144
1
Index Marking
1) _{Does not include plastic or metal protrusion of 0.25 max. per side}
2) _{Does not include dambar protrusion of 0.08 max. per side}
Figure 26 P-TQFP-144-19 (Plastic Thin Quad Flat Package)
GPP09243
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
86
Dimensions in mm
V1.0, 2005-06