HYS64D128021 Datasheet, PDF (7/23 Pages) Infineon Technologies AG – 200-Pin Small Outline Dual-In-Line Memory Modules

Table 2
Type
Ordering Information
Compliance Code
PC3200 (CL=3)
HYS64D128021GBDL–5–B
PC2700 (CL=2.5)
HYS64D128021GBDL–6–B
PC3200S–3033–1–Z
PC2700S-2533–0–Z
HYS64D128021[H/G]BDL–[5/6]–B
Small Outline DDR SDRAM Modules
Overview
Description
two ranks 1 GB SO-DIMM
two ranks 1 GB SO-DIMM
SDRAM
Technology
512 MBit (×8)
512 MBit (×8)
PC3200 (CL=3)
HYS64D128021HBDL–5–B
PC2700 (CL=2.5)
HYS64D128021HBDL–6–B
PC3200S–3033–1–Z
PC2700S-2533–0–Z
two ranks 1 GB SO-DIMM
two ranks 1 GB SO-DIMM
512 MBit (×8)
512 MBit (×8)
Note:
1. All part numbers end with a place code designating the silicon-die revision. Reference information available on
request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components.
2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the
latencies and SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD¹⁾ latency of
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
1) RCD: Row-Column-Delay
Data Sheet
7
Rev. 0.5, 2003-12