TLE94112EL Datasheet, PDF (6/80 Pages) Infineon Technologies AG – a protected twelve-fold half-bridge driver designed especially for automotive motion control applications

TLE94112EL
Pin Configuration
Pin Symbol
Function
13
GND
Ground. All ground pins should be externally connected together.
14
OUT 3
Power half-bridge 3
15
OUT 10
Power half-bridge 10
16
VS1
Main supply voltage for power half bridges. VS1 should be externally connected to
VS2.
17
OUT 11
Power half-bridge 11
18
OUT 12
Power half-bridge 12
19
CSN
Chip select Not input with internal pull up
20
SCLK
Serial clock input with internal pull down
21
VS2
Main supply voltage for power half bridges. VS1 should be externally connected to
VS2.
22
OUT 8
Power half-bridge 8
23
OUT 2
Power half-bridge 2
24
GND
Ground. All ground pins should be externally connected together.
EDP -
Exposed Die Pad; For cooling and EMC purposes only - not usable as electrical
ground. Electrical ground must be provided by pins 1,12,13,24. ¹⁾
1) The exposed die pad at the bottom of the package allows better heat dissipation from the device via the PCB. The
exposed pad (EP) must be either left open or connected to GND. It is recommended to connect EP to GND for best
EMC and thermal performance.
Data Sheet
6
1.0
2016-08-27