TLE94112EL Datasheet, PDF (12/80 Pages) Infineon Technologies AG – a protected twelve-fold half-bridge driver designed especially for automotive motion control applications

TLE94112EL
General Product Characteristics
3.3
Thermal Resistance
Table 4 Thermal Resistance TLE94112EL
Parameter
Symbol
Values
Unit Note or
Number
Min. Typ. Max.
Test Condition
Junction to Case, T_A = -40°C
R_{thjC_cold} –
5–
Junction to Case, T_A = 85°C
R_{thjC_hot} –
6–
Junction to ambient, T_A = -40°C R_{thjA_cold_} –
(1s0p, minimal footprint)
min
69 –
Junction to ambient, T_A = 85°C R_{thjA_hot_m} –
(1s0p, minimal footprint)
in
70 –
Junction to ambient, T_A = -40°C R_{thjA_cold_3} –
(1s0p, 300mm2 Cu)
00
41 –
Junction to ambient, T_A = 85°C R_{thjA_hot_30} –
(1s0p, 300mm2 Cu)
0
44 –
Junction to ambient, T_A = -40°C R_{thjA_cold_6} –
(1s0p, 600mm2 Cu)
00
40 –
Junction to ambient, T_A = 85°C R_{thjA_hot_60} –
(1s0p, 600mm2 Cu)
0
43 –
Junction to ambient, T_A = -40°C R_{thjA_cold_2} –
(2s2p)
s2p
24 –
Junction to ambient, T_A = 85°C R_{thjA_hot_2s} –
(2s2p)
2p
29 –
1) Not subject to production test, specified by design.
K/W ¹⁾
K/W ¹⁾
K/W ^{1) 2)}
K/W ^{1) 2)}
K/W ^{1) 3)}
K/W ^{1) 3)}
K/W ^{1) 4)}
K/W ^{1) 4)}
K/W ^{1) 5)}
K/W ^{1) 5)}
2) Specified R_thJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 1s0p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with minimal footprint copper area and 35µm thickness.
Ta = -40°C, each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
3) Specified R_thJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 1s0p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with additional cooling of 300mm2 copper area and 35µm
thickness. Ta = -40°C, each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
4) Specified R_thJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 1s0p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with additional cooling of 600mm2 copper area and 35µm
thickness. Ta = -40°C, each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
5) Specified R_thJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 2s2p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with two inner copper layers ( 4 x 35µm Cu). Ta = -40°C,
each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
Data Sheet
12
1.0
2016-08-27