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SGP30N60HS_09 Datasheet, PDF (2/12 Pages) Infineon Technologies AG – High Speed IGBT in NPT-technology 30% lower Eoff compared to previous generation
Thermal Resistance
Parameter
Characteristic
IGBT thermal resistance,
junction – case
Thermal resistance,
junction – ambient
SGP30N60HS
SGW30N60HS
Symbol
Conditions
RthJC
RthJA
PG-TO-220-3-1
PG-TO-247-3-21
Max. Value
Unit
0.5
K/W
62
40
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Static Characteristic
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Gate-emitter threshold voltage
Zero gate voltage collector current
Gate-emitter leakage current
Transconductance
V(BR)CES
VCE(sat)
VGE(th)
ICES
IGES
gfs
VGE=0V, IC=500µA
VGE = 15V, IC=30A
Tj=25°C
Tj=150°C
IC=700µA,VCE=VGE
VCE=600V,VGE=0V
Tj=25°C
Tj=150°C
VCE=0V,VGE=20V
VCE=20V, IC=30A
min.
600
3
-
-
-
-
Value
Typ.
-
2.8
3.5
4
-
-
-
20
Unit
max.
-V
3.15
4.00
5
µA
40
3000
100 nA
-S
Dynamic Characteristic
Input capacitance
Ciss
VCE=25V,
-
1500
pF
Output capacitance
Coss
VGE=0V,
-
150
Reverse transfer capacitance
Crss
f=1MHz
-
92
Gate charge
QGate
VCC=480V, IC=30A
-
141
nC
VGE=15V
Internal emitter inductance
LE
PG-TO-220-3-1
-
7
nH
measured 5mm (0.197 in.) from case
PG-TO-247-3-21
13
Short circuit collector current1)
IC(SC)
VGE=15V,tSC≤10µs
-
220
A
VCC ≤ 600V,
Tj ≤ 150°C
1) Allowed number of short circuits: <1000; time between short circuits: >1s.
Power Semiconductors
2
Rev. 2.4 Nov 09