HYS72D32500GR-7F-B Datasheet, PDF (2/22 Pages) Infineon Technologies AG – Low Profile Registered DDR-I SDRAM-Modules

HYS 72Dxx5xxGR-7F/7/8-B
Registered DDR-I SDRAM-Modules
Ordering Information
Type
Compliance
Code
Description
SDRAM
Technology
Module
height
PC2100 (CL=2):
HYS 72D32500GR-7F-B PC2100R-20220-L one bank 256 MB Reg. DIMM 256 MBit (x8)
1.2”
HYS 72D32500GR-7-B PC2100R-20330-L one bank 256 MB Reg. DIMM 256 MBit (x8)
1.2”
HYS 72D64500GR-7F-B PC2100R-20220-M one bank 512 MB Reg. DIMM 256 Mbit (x4)
1.2”
HYS 72D64500GR-7-B PC2100R-20330-M one bank 512 MB Reg. DIMM 256 Mbit (x4)
1.2”
HYS 72D128520GR-7F-B PC2100R-20220-N two banks 1 GByte Reg.
DIMM
256 MBit (x4)
1.2”
(stacked with
soldering process)
HYS 72D128520GR-7-B PC2100R-20330-N two banks 1 GByte Reg.
DIMM
256 MBit (x4)
1.2”
(stacked with
soldering process)
HYS 72D128521GR-7F-B PC2100R-20220-N two banks 1 GByte Reg.
DIMM
256 MBit (x4)
1.2”
(stacked with laser
welding process)
HYS 72D128521GR-7-B PC2100R-20330-N two banks 1 GByte Reg.
DIMM
256 MBit (x4)
1.2”
(stacked with laser
welding process)
PC1600 (CL=2):
HYS 72D32500GR-8-B PC1600R-20220-L one bank 256 MB Reg. DIMM 256 MBit (x8)
1.2”
HYS 72D64500GR-8-B PC1600R-20220-M one bank 512 MB Reg. DIMM 256 Mbit (x4)
1.2”
HYS 72D128520GR-8-B PC1600R-20220-N two banks 1 GByte Reg.
DIMM
256 MBit (x4)
1.2”
(stacked with
soldering process)
HYS 72D128521GR-8-B PC1600R-20220-N two banks 1 GByte Reg.
DIMM
256 MBit (x4)
1.2”
(stacked with laser
welding process)
Notes:
1. All part numbers end with a place code (not shown), designating the silicon-die revision. Reference information
available on request. Example: HYS 72D32500GR-8-A, indicating Rev.A die are used for SDRAM components.
2. The Compliance Code is printed on the module labels and describes the speed sort fe. “PC2100R”, the latencies (f.e.
“20330” means CAS latency = 2.5, trcd latency = 3 and trp latency =3 ) and the Raw Card used for this module
INFINEON Technologies
2
2002-08-16 (0.91)