SLB9665 Datasheet, PDF (19/24 Pages) Infineon Technologies AG – Trusted Platform Module

SLB 9665 TPM2.0
Trusted Platform Module
Package Dimensions (VQFN)
7
Package Dimensions (VQFN)
All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS
compliant.
5
7 x 0.5 = 3.5
A
B
0.1 A 2x
0.9 MAX.
0.5
32x
0.05 C
17
0.1 C
16
24
25
0.1 B 2x Index Marking
C
(0.2)
0.05 MAX.
Figure 7-1 Package Dimensions PG-VQFN-32-13
9
32
8
1 _{Index Marking}
3.6±0.1
0.25
+0.05
-0.07
32x
0.1 M
A
B
C
0.05 M C
0.4±0.05 (4.2)
PG-VQFN-32-13-PO V01
7.1
Packing Type
PG-VQFN-32-13: Tape & Reel (reel diameter 330mm), 5000 pcs. per reel
8
0.3
Index Marking
5.25
Figure 7-2 Tape & Reel Dimensions PG-VQFN-32-13
1.1
PG-VQFN-32-13-TP V01
7.2
Recommended Footprint
Figure 7-3 shows the recommended footprint for the PG-VQFN-32-13 package. The exposed pad of the
package is internally connected to GND. It shall be connected to GND externally as well.
4.1
3.6
Package outline 5 x 5
0.5
0.25
Figure 7-3 Recommended Footprint PG-VQFN-32-13
Data Sheet
19
PG-VQFN-32-13-FP V01
Revision 1.0 2015-10-27