SLB9665 Datasheet, PDF (18/24 Pages) Infineon Technologies AG – Trusted Platform Module

SLB 9665 TPM2.0
Trusted Platform Module
Package Dimensions (TSSOP)
6.2
Recommended Footprint
Controlling dimension is millimeters (mm).
0.29
0.25
0.65
0.65
Copper Solder mask
Figure 6-3 Recommended Footprint PG-TSSOP-28-2
Stencil apertures
PG-TSSOP-28-2, -16-FP V01
6.3
Chip Marking
Line 1: SLB9665TT20 or SLB9665XT20, see Table 3-1
Line 2: G <datecode> KMC, <K> indicates assembly site code, <MC> indicates mold compound code
Line 3: 00 <Lot number>, the 00 is an internal FW indication (only at manufacturing due to field upgrade
option)
12345678901
G
KMC
12XXXXXXXXXXX
Assembly Site Code
Mold Compound Code
Softwarecode Lot Code
Figure 6-4 Chip Marking PG-TSSOP-28-2
ChipMarking.vsd
Data Sheet
18
Revision 1.0 2015-10-27