SLB9660 Datasheet, PDF (17/22 Pages) Infineon Technologies AG – Trusted Platform Module

SLB 9660 TPM1.2
Trusted Platform Module
Package Dimensions (TSSOP)
6.2
Recommended Footprint
0.29
0.25
0.65
0.65
Copper Solder mask
Figure 6-3 Recommended Footprint PG-TSSOP-28-2
Stencil apertures
PG-TSSOP-28-2, -16-FP V01
6.3
Chip Marking
Line 1: SLB9660TT12 or SLB9660XT12, see Table 3-1
Line 2: G <datecode> KMC, <K> indicates assembly site code, <MC> indicates mold compound code
Line 3: 00 <Lot number>, the 00 is an internal FW indication (only at manufacturing due to field upgrade
option)
12345678901
G
KMC
12XXXXXXXXXXX
Assembly Site Code
Mold Compound Code
Softwarecode Lot Code
Figure 6-4 Chip Marking PG-TSSOP-28-2
ChipMarking.vsd
Data Sheet
17
Revision 1.0 2014-12-12