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HYS72D16500GR Datasheet, PDF (16/29 Pages) Infineon Technologies AG – Low Profile DDR SDRAM-Modules
HYS72D[16500/32501]GR-[7/8]-A
Low Profile Registered DDR SDRAM-Modules
Electrical Characteristics
Table 8 Electrical Characteristics and DC Operating Conditions (cont’d)
Parameter
Symbol
Values
Unit Note/Test Condition 1)
Min.
Typ.
Max.
Output Leakage Current IOZ
–5
Output High Current,
IOH
—
Normal Strength Driver
5
–16.2
µA DQs are disabled;
0 V ≤ VOUT ≤ VDDQ 7)
mA VOUT = 1.95 V 7)
Output Low
IOL
Current, Normal Strength
Driver
16.2
—
mA VOUT = 0.35 V 7)
1) 0 °C ≤ TA ≤ 70 °C
2) Under all conditions, VDDQ must be less than or equal to VDD.
3) Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC). VREF is also expected to track noise variations in VDDQ.
4) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal
to VREF, and must track variations in the DC level of VREF.
5) VID is the magnitude of the difference between the input level on CK and the input level on CK.
6) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire
temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the
maximum difference between pull-up and pull-down drivers due to process variation.
7) Inputs are not recognized as valid until VREF stabilizes.
8) Values are shown per component
Data Sheet
16
Rev. 1.2, 2004-06
10292003-DNYO-BD9L