ICS8714008I Datasheet, PDF (28/34 Pages) Integrated Device Technology – Output frequency range

ICS8714008I DATA SHEET
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Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8714008I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8714008I is the sum of the core power plus the analog power plus the output power dissipated due to
the load. The following is the power dissipation for V_DD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating output power dissipated due to the load.
• Power (core)_MAX = V_{DD_MAX} * (I_{DD_MAX} + I_{DDA_MAX}) = 3.465V *(210mA + 15mA) = 779.6mW
• Power (outputs)_MAX = 44.5mW/Loaded Output pair
If all outputs are loaded, the total power is 9 * 44.5mW = 400.5mW
Total Power__MAX = 779.6mW + 400.5mW = 1180.1mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = _JA * Pd_total + T_A
Tj = Junction Temperature
_JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T_A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance _JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 26.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 1.180W * 26.7°C/W = 116.5°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance _JA for 56-Lead VFQFN, Forced Convection
_JA vs. Air Flow
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
26.7°C/W
1
21.71°C/W
2
20.23°C/W
ICS8714008DKI REVISION A NOVEMBER 25, 2013
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