ICSSSTUAH32868A Datasheet, PDF (20/22 Pages) Integrated Device Technology – 28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

ICSSSTUAH32868A
28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2
COMMERCIAL TEMPERATURE GRADE
Package Outline and Package Dimensions - BGA
Package dimensions are kept current with JEDEC Publication No. 95
A1
D
SEATING
PLANE
C
T
b REF
d TYP
D1
Numeric Designations
for Horizontal Grid
4321
A
B
C
D
Alpha Designations
for Vertical Grid
(Letters I, O, Q, and
S not used)
TOP VIEW
E
h TYP
c REF
0.12 C
-e- TYP
-e- TYP
E1
ALL DIMENSIONS IN MILLIMETERS
T
BALL GRID
D
E
Min/Max
e Horiz Vert Total
15.00 Bsc 6.00 Bsc 0.94/1.20 0.65 Bsc 8 22 176
d
Min/Max
0.35/0.45
h
Min/Max
0.25/0.35
REF. DIMS
D1
E1
b
c
13.65 Bsc 4.55 Bsc 0.675 0.725 ***
NOTE: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
* Source Ref.: JEDEC Publication 95, MO-205*, MO-255**, MO-246***
10-0055
28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2
20
ICSSSTUAH32868A
7115/9