ICSSSTUAF32869A Datasheet, PDF (19/21 Pages) Integrated Device Technology – 14-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

ICSSSTUAF32869A
14-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2
COMMERCIAL TEMPERATURE GRADE
Package Outline and Package Dimensions - BGA
Package dimensions are kept current with JEDEC Publication No. 95
TOP VIEW
A1 CORNER
1 2 3 4 5 6 7 8 9 10 11
A
B
C
D
E
F
G
H
D
J
K
L
M
N
P
R
T
U
V
W
0.25 REF
C
h = 0.27 ~ 0.37
1.20 MAX
E
T
b
0.03 REF
// 0.20 C
0.12 C
A
B
BOTTOM VIEW
∅0.08 M C
∅0.15 M C A B
d = ∅0.38 ~ 0.48(150X)
A1 CORNER
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
0.65
E1 6.50
8.00 ± 0.05
0.15(4X)
ALL DIMENSIONS IN MILLIMETERS
D
13.00 Bsc
E
8.00 Bsc
T
Min/Max
0.90/1.20
e
0.65 Bsc
BALL GRID
Horiz Vert Total
11 19 150
d
Min/Max
0.35/0.48
h
Min/Max
0.25/0.37
c
D1
E1
11.70 Bsc 6.50 Bsc
NOTE: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
REF. DIMS
b
c
0.65 0.75
14-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2
19
ICSSSTUAF32869A
7095/13