ICSSSTUAH32865A Datasheet, PDF (15/17 Pages) Integrated Device Technology – 25-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

IDT74SSTUBH32865A
28-BIT 1:2 REGISTERED BUFFER FOR DDR2
COMMERCIAL TEMPERATURE GRADE
Package Outline and Package Dimensions - BGA
Package dimensions are kept current with JEDEC Publication No. 95
ROW A,
COLUMN 1
12 11 10 9 8 7 6 5 4 3 2 1
0.925 Ref
C
A
B
C
D
E
F
G
H
D
J
K
L
d
M
N
P
R
T
b
U
0.975
Ref
V
h
E
T
e _TYP
0.10 C
ALL DIMENSIONS IN MILLIMETERS
D
13.00 Bsc
E
9.00 Bsc
T
Min/Max
1.10/1.30
e
0.65 Bsc
BALL GRID
Horiz Vert Total
12 18 160
d
Min/Max
0.35/0.45
h
Min/Max
0.27/0.37
NOTE: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
REF. DIMS
b
c
0.975 0.925
28-BIT 1:2 REGISTERED BUFFER FOR DDR2
15
IDT74SSTUBH32865A 7103/10