ICSLV810 Datasheet, PDF (9/12 Pages) Integrated Circuit Systems – Buffer/Clock Driver

ICSLV810
Buffer/Clock Driver
Thermal Characteristics for 20QSOP
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θ_JA Still air
θ_JA 1 m/s air flow
θ_JA 3 m/s air flow
Thermal Resistance Junction to Case θ_JC
Thermal Characteristics for 20SOIC
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θ_JA Still air
θ_JA 1 m/s air flow
θ_JA 3 m/s air flow
Thermal Resistance Junction to Case θ_JC
Min.
Typ.
135
93
78
60
Max.
Units
°C/W
°C/W
°C/W
°C/W
Min.
Typ.
83
71
58
46
Max.
Units
°C/W
°C/W
°C/W
°C/W
From Output
Under Test
CL=3pF
Figure 1. Load Circuit
Input
t_PLH
Output
Figure 2. Propagation Delay
500 ohm
t_PHL
V _IH
V _IL
V_OH
V_OL
Input
t_PLH1
t_PHL1
Output 1
t_SK
t_SK
Output 2
t_PLH2
t_PHL2
( t_SK(O)=|t_PLH2-t_PHL2| or |t_PLH1-t_PHL1| )
Figure 3. Output Skew
V_OH
V_OL
V_OH
V_OL
Input
t_PLH1
t_PHL1
Output 1
Figure 4. Pulse Skew ( tSK(p)=|tpLH – tpH| )
V_OH
V_OL
Input
t_PLH1
t_PHL1
Package
1 Output
t_SK
t_SK
Package
2 Output
t_PLH2
t_PHL2
( t_SK(O)=|t_PLH2-t_PHL2| or |t_PLH1-t_PHL1| )
Figure 5. Part-to-Part Skew
V_OH
V_OL
V_OH
V_OL
MDS LV810 F
9
Revision 101305
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126 ● tel [phone] ● www.icst.com