ICSLV810 Datasheet, PDF (3/12 Pages) Integrated Circuit Systems – Buffer/Clock Driver

ICSLV810
Buffer/Clock Driver
External Components
The ICSLV810 requires a minimum number of external
components for proper operation.
Decoupling Capacitors
Decoupling capacitors of 0.01µF must be connected
between VDD and GND, as close to these pins as
possible. For optimum device performance, the
decoupling capacitors should be mounted on the
component side of the PCB. Avoid the use of vias in the
decoupling circuit.
Series Termination Resistor
When the PCB trace between the clock outputs and the
loads are over 1 inch, series termination should be
used. To series terminate a 50Ω trace (a commonly
used trace impedance) place a 33Ω resistor in series
with the clock line, as close to the clock output pin as
possible. The nominal impedance of the clock output is
20Ω.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) The 0.01µF decoupling capacitors should be
mounted on the component side of the board as close
to the VDD pins as possible. No vias should be used
between the decoupling capacitors and VDD pins. The
PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
2) To minimize EMI the 33Ω series termination resistor,
if needed, should be placed close to the clock output.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICSLV810. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Item
Supply Voltage, VDD MAX
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
Rating
7V
-0.5 V to VDDA + 1.2 V
-40 to +85°C
-65 to +150°C
125°C
260°C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured with respect to GND), VDDA
Power Supply Voltage (measured with respect to GND), VDDB
Power Supply Voltage (measured with respect to GND), VDDC
Min.
-40
1.425
1.425
1.425
Typ.
Max.
+85
2.625
2.625
2.625
Units
°C
V
V
V
MDS LV810 F
3
Revision 101305
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