HY62UF16201A Datasheet, PDF (9/11 Pages) Hynix Semiconductor – 128Kx16bit full CMOS SRAM

HY62UF16201A Series
PACKAGE INFORMATION
48ball Fine Pitch Ball Grid Array Package(F)
BOTTOM VIEW
B
A
6 5 4 3 21
A
A
B
C
D
C
E
F
G
H
C1/2
A1 CORNER
INDEX AREA
C1/2
TOP VIEW
B1/2
5
C
E
3 D(DIAMETER)
B1/2
SIDE VIEW
A
B1
E1
E2
SEATING PLANE
4
r
[ HY62UF16201AF ]
Symbol
Min.
Typ.
A
-
0.75
B
-
3.75
B1
6.90
7.00
C
-
5.25
C1
7.90
8.00
D
0.3
0.35
E
-
-
E1
0.75
0.80
E2
0.17
-
r
-
-
Max.
-
-
7.10
-
8.10
0.4
1.10
0.85
-
0.12
[ HY62UF16201AF1 ]
Min.
Typ.
Max.
-
0.75
-
-
3.75
-
5.90
6.00
6.10
-
5.25
-
7.90
8.00
8.10
0.3
0.35
0.4
-
1.0
1.10
-
0.75
-
0.2
0.25
0.3
-
-
0.08
Note
1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
Rev.08 / Mar. 2002
C1
8