HY62LF16404D Datasheet, PDF (9/10 Pages) Hynix Semiconductor – 256Kx16bit full CMOS SRAM

HY62LF16404D Series
PACKAGE INFORMATION
48ball Fine Pitch Ball Grid Array Package (F)
BOTTOM VIEW
B
A
6 5 4 3 21
A
A
B
C
D
C
E
F
G
H
A1 CORNER
INDEX AREA
C1/2
TOP VIEW
C1
5
C
E
3 D(DIAMETER)
B1/2
SIDE VIEW
A
B1
E1
E2
SEATING PLANE
4
r
Symbol
Min.
A
-
B
-
B1
5.9
C
-
C1
7.9
D
0.3
E
0.9
E1
-
E2
0.20
r
-
Typ.
0.75
3.75
6.0
5.25
8.0
0.35
1.0
0.75
0.25
-
Max.
-
-
6.1
-
8.1
0.4
1.10
-
0.30
0.08
Note
1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
Rev.03 / Aug.01
8