HYMD532M646CLP6-D43 Datasheet, PDF (7/20 Pages) Hynix Semiconductor – 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. (TSOP)

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200pin DDR SDRAM SO-DIMMs
IDD SPECIFICATION AND CONDITIONS (TA=0 to 70^oC, Voltage referenced to VSS = 0V)
256MB, 32M x 64 Unbuffered DIMM: HYMD532M646C[L]P6
Symbol
Test Condition
IDD0
IDD1
IDD2P
IDD2F
IDD3P
IDD3N
IDD4R
IDD4W
IDD5
IDD6
IDD7
One bank; Active - Precharge; tRC=tRC(min);
tCK=tCK(min); DQ,DM and DQS inputs changing
twice per clock cycle; address and control inputs
changing once per clock cycle
One bank; Active - Read - Precharge; Burst
Length=2; tRC=tRC(min); tCK=tCK(min); address
and control inputs changing once per clock cycle
All banks idle; Power down mode; CKE=Low,
tCK=tCK(min)
/CS=High, All banks idle; tCK=tCK(min); CKE=
High; address and control inputs changing once
per clock cycle. VIN=VREF for DQ, DQS and DM
One bank active ; Power down mode; CKE=Low,
tCK=tCK(min)
/CS=HIGH; CKE=HIGH; One bank; Active-Pre-
charge; tRC=tRAS(max); tCK=tCK(min); DQ, DM
and DQS inputs changing twice per clock cycle;
Address and other control inputs changing once
per clock cycle
Burst=2; Reads; Continuous burst; One bank
active; Address and control inputs changing once
per clock cycle; tCK=tCK(min); IOUT=0mA
Burst=2; Writes; Continuous burst; One bank
active; Address and control inputs changing once
per clock cycle; tCK=tCK(min); DQ, DM and DQS
inputs changing twice per clock cycle
tRC=tRFC(min) - 8*tCK for DDR200 at 100Mhz,
10*tCK for DDR266A & DDR266B at 133Mhz; dis-
tributed refresh
CKE=<0.2V; External clock on; tCK Normal
=tCK(min)
Low Power
Four bank interleaving with BL=4 Refer to the fol-
lowing page for detailed test condition
DDR400B
520
680
840
920
1040
1440
Speed
DDR333
480
600
40
140
180
240
760
840
960
20
12
1400
DDR266B
Unit Note
400
mA
480
mA
mA
mA
mA
mA
680
mA
720
mA
880
mA
mA
mA
1360
mA
* Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap.
Rev. 1.3 / Feb. 2006
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