HY27UH08AG5B Datasheet, PDF (3/51 Pages) Hynix Semiconductor – 16Gbit (2Gx8bit) NAND Flash

FEATURES SUMMARY
HIGH DENSITY NAND FLASH MEMORIES
- Cost effective solutions for mass storage applications
MULTIPLANE ARCHITECTURE
- Array is split into two independent planes. Parallel
Operations on both planes are available, halving
Program and erase time.
NAND INTERFACE
- x8 bus width.
- Address/ Data Multiplexing
- Pinout compatiblity for all densities
SUPPLY VOLTAGE
- 3.3V device : Vcc = 2.7 V ~3.6 V
MEMORY CELL ARRAY
- x8 : (2K + 64) bytes x 64 pages x 16384 blocks
PAGE SIZE
- (2K + 64 spare) Bytes
BLOCK SIZE
- (128K + 4Kspare) Bytes
PAGE READ / PROGRAM
- Random access : 25us (max.)
- Sequential access : 25ns (min.)
- Page program time : 200us (typ.)
- Multi-page program time (2 pages) : 200us (Typ)
COPY BACK PROGRAM
- Automatic block download without latency time
FAST BLOCK ERASE
- Block erase time: 1.5ms (Typ)
- Multi-block erase time (2 blocks) : 1.5ms (Typ)
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HY27UH08AG5B Series
16Gbit (2Gx8bit) NAND Flash
STATUS REGISTER
- Normal Status Register (Read/Program/Erase)
- Extended Status Register (EDC)
ELECTRONIC SIGNATURE
- 1st cycle : Manufacturer Code
- 2nd cycle : Device Code
- 3rd cycle : Internal chip number, Cell Type, Number of
Simultaneously Programmed Pages.
- 4th cycle : Page size, Block size, Organization, Spare
size
- 5th cycle : Multiplane information
CHIP ENABLE DON’T CARE
- Simple interface with microcontroller
HARDWARE DATA PROTECTION
- Program/Erase locked during Power transitions.
DATA RETENTION
- 100,000 Program/Erase cycles (with 1bit/528byte ECC)
- 10 years Data Retention
PACKAGE
- HY27UH08AG5B-T(P)
: 48-Pin TSOP1 (12 x 20 x 1.2 mm)
- HY27UH08AG5B-T (Lead)
- HY27UH08AG5B-TP (Lead Free)
Rev 0.2 / Jan. 2008
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