HCPL9000 Datasheet, PDF (7/12 Pages) Agilent(Hewlett-Packard) – High Speed Digital Isolators

Insulation and Safety Related Specifications
Parameters
Condition
Barrier Impedance
Single Channel
Dual Channel
Quad Channel
Creepage Distance (External)
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC Narrow Body
16-Pin SOIC Wide Body
Leakage Current
240 V_RMS
60 Hz
Min.
7.036
4.026
4.026
8.077
Typ.
>10¹⁴||3
>10¹⁴||3
>10¹⁴||7
Max.
Units
Ω ||pF
mm
0.2
µA
Absolute Maximum Ratings
Parameters
Symbol
Min.
Max.
Units
Storage Temperature
T_S
–55
Ambient Operating Temperature^[1]
T_A
–55
Supply Voltage
V_DD1, V_DD2
–0.5
Input Voltage
V_IN
–0.5
Voltage Output Enable (HCPL-9000/-0900)
V_OE
–0.5
Output Voltage
V_OUT
–0.5
Output Current Drive
I_OUT
Lead Solder Temperature (10s)
175
°C
125
°C
7
V
V_DD1 +0.5
V
V_DD2 +0.5
V
V_DD2 +0.5
V
10
mA
260
°C
ESD
2 kV Human Body Model
Notes:
1. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not
guarantee performance.
Recommended Operating Conditions
Parameters
Symbol
Min.
Max.
Units
Ambient Operating Temperature
T_A
–40
100
°C
Supply Voltage
V_DD1, V_DD2
3.0
5.5
V
Logic High Input Voltage
V_IH
2.4
V_DD1
V
Logic Low Input Voltage
V_IL
0
0.8
V
Input Signal Rise and Fall Times
t_IR, t_IF
1
µs
This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, Agilent recommends that all integrated circuits
be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to
complete failure.
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