HCPL-7860 Datasheet, PDF (16/28 Pages) Agilent(Hewlett-Packard) – Isolated 15-bit A/D Converter

Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Input Voltage
Output Voltage
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Min.
Max.
Units
T_S
-55
+125
°C
T_A
-40
+85
°C
V_DD
0
5.5
V
All Inputs
-0.5
V_DD + 0.5
V
All Outputs
-0.5
V_DD + 0.5
V
260°C for 10 seconds, 1.6 mm below seating plane
See Reflow Thermal Profile
Note:
17. HP recommends the use of non-chlorinated solder fluxes.
Note
17
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltage
Input Voltage
Symbol
T_A
V_DD
All Inputs
Min.
-40
4.5
0
Max.
+85
5.5
V_DD
Units
°C
V
V
Note
1-275