HCPL-7860 Datasheet, PDF (11/28 Pages) Agilent(Hewlett-Packard) – Isolated 15-bit A/D Converter

300
250
P_Si, OUTPUT
200
P_Si, INPUT
150
MAX. OPERATING
TEMP. IS 100 °C
100
50
0
0
50
100
150
200
T_A – TEMPERATURE – °C
Figure 13. Dependence of Safety-
Limiting Values on Temperature.
Insulation and Safety Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol Value
L(I01) 7.4
L(I02) 8.0
0.5
CTI 175
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltages
Steady-State Input Voltage
Two Second Transient Input Voltage
Output Voltages
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Min.
Max.
Units Note
T_S
-55
125
°C
T_A
-40
+85
°C
V_DD1, V_DD2
0
5.5
Volts
V_IN+, V_IN-
-2.0
V_DD1 + 0.5 Volts
16
-6.0
MCLK, MDAT -0.5
V_DD2 +0.5
Volts
260°C for 10 sec., 1.6 mm below seating plane
17
See Maximum Solder Reflow Thermal Profile section
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Voltage
Symbol
T_A
V_DD1, V_DD2
V_IN+, V_IN-
1-270
Min.
-40
4.5
-200
Max.
+85
5.5
+200
Units
°C
V
mV
Note
16