HDMP-1022 Datasheet, PDF (13/40 Pages) Agilent(Hewlett-Packard) – Low Cost Gigabit Rate Transmit/Receive Chip Set with TTL I/Os

HDMP-1022 (Tx)
Thermal Characteristics, T_A = 25°C, V_CC = 5 V
Symbol
Θ_ja
Θ_jc
Parameter
Thermal Resistance, Junction to Air. Measured in still air with the package
mounted on a thermal test PCB per JEDEC standard JC -15.1
Thermal Resistance, Junction to Case. Top center of the package is used as
the reference point
P_D Power Dissipation, V_CC = 5 Volts
Units Typ.
°C/Watt 24
°C/Watt 4
Watt 1.9
HDMP-1024 (Rx)
Thermal Characteristics, T_A = 25°C, V_CC = 5 V
Symbol
Θ_ja
Θ_jc
Parameter
Thermal Resistance, Junction to Air. Measured in still air with the package
mounted on a thermal test PCB per JEDEC standard JC -15.1
Thermal Resistance, Junction to Case. Top center of the package is used as
the reference point
P_D Power Dissipation, V_CC = 5 Volts
Units Typ.
°C/Watt 24
°C/Watt 4
Watt 2.5
I/O Type Definitions
I/O Type
Definition
I-TTL Input TTL. Floats high when left open.
O-TTL
O-BLL
I-H50
Output TTL.
50 Ω matched output driver. Will drive AC coupled 50 Ω loads, with 150 Ω pull-up resistors
for broad band matching. All unused outputs should have 150 Ω pull-up resistors, and AC
coupled to a 50 Ω resistor to ground.
Input with internal 50 Ω terminations. Input is diode level shifted so that it can swing around
power. Can be driven with single-end configuration. Commonly used with input single-end AC
coupling from an O-BLL driver or another 50 Ω source, or differential direct coupling from
an O-BLL driver.
C
Filter capacitor node.
S
Power supply or ground.
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