HDMP-0422 Datasheet, PDF (12/14 Pages) Agilent(Hewlett-Packard) – Single Port Bypass Circuit with CDR & Data Valid Detection Capability for Fibre Channel Arbitrated Loops

Package Information
Power Dissipation and Thermal Resistance. VCC = 3.15 V to 3.45 V.
Symbol Parameter
Units
Typ.
Max.
P_D
Θ_jc[1]
Power Dissipation
Thermal Resistance, Junction to Case
mW
460
°C/W
14
Note:
1. Based on independent package testing by Agilent. Θja for this device is 57ºC/W. Θja is measured on a standard 3x3” FR4 PCB in a still air
environment. To determine the actual junction temperature in a given application, use the following equation:
Tj = TC + (Θja x PD), where TC is the case temperature measured on the top center of the package and PD is the power being dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity (Seating Plane)
Details
Plastic Shrink Small Outline (SSOP) Per JESD Pub 95, MO-150, Var AG
85% Tin, 15% Lead
200-800 micro-inches
0.15 mm max
0.10 mm max
Mechanical Dimensions
D
c
24 23 22 21 20 19 18 17 16 15 14 13
TOP VIEW
E1
E
1 2 3 4 5 6 7 8 9 10 11 12
PIN #1 ID
b
A2
A1
e
L
0.25
GAGE
PLANE
A
SEATING PLANE
DIMENSION E1 D E
b
e
L
c
A2 A1 A
HDMP-0422
TOLERANCE
5.30
8.20
7.80
0.22/
0.38
±0.30
±0.30
±0.40
MIN./
MAX.
0.65
BSC
0.90
+0.13/
–0.27
0.09/
0.20
MIN./
MAX.
1.75
±0.13
0.05/
0.25
MIN./
MAX.
2.13
MAX.
ALL DIMENSIONS ARE IN MILLIMETERS
Figure 11. HDMP-0422 package drawing.
12