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2SK1299 Datasheet, PDF (3/9 Pages) Hitachi Semiconductor – Silicon N-Channel MOS FET
2SK1299(L), 2SK1299(S)
Electrical Characteristics (Ta = 25°C)
Item
Symbol Min
Drain to source breakdown
voltage
V(BR)DSS 100
Gate to source breakdown
voltage
V(BR)GSS ±20
Gate to source leak current
I GSS
—
Zero gate voltage drain current IDSS
—
Gate to source cutoff voltage VGS(off) 1.0
Static Drain to source on state RDS(on) —
resistance
—
Forward transfer admittance |yfs|
2.4
Input capacitance
Ciss —
Output capacitance
Coss —
Reverse transfer capacitance Crss —
Turn-on delay time
t d(on)
—
Rise time
tr
—
Turn-off delay time
t d(off)
—
Fall time
tf
—
Body to drain diode forward VDF
—
voltage
Body to drain diode reverse trr
—
recovery time
Note: 1. Pulse test
Typ Max Unit
—
—
V
—
—
V
—
±10 µA
—
100 µA
—
2.0
V
0.25 0.35 Ω
0.30 0.45 Ω
4.0
—
S
400 —
pF
165 —
pF
45
—
pF
5
—
ns
35
—
ns
160 —
ns
60
—
ns
1.0
—
V
135 —
ns
Test conditions
ID = 10 mA, VGS = 0
IG = ±100 µA, VDS = 0
VGS = ±16 V, VDS = 0
VDS = 80 V, VGS = 0
ID = 1 mA, VDS = 10 V
ID = 2 A, VGS = 10 V *1
ID = 2 A, VGS = 4 V 1*
ID = 2 A, VDS = 10 V *1
VDS = 10 V, VGS = 0,
f = 1 MHz
ID = 2 A, VGS = 10 V,
RL = 15 Ω
IF = 3 A, VGS = 0
IF = 3 A, VGS = 0,
diF/dt = 50 A/µs
3