FH39-25S-0.3SHW Datasheet, PDF (5/11 Pages) Hirose Electric – 0.3 mm Pitch, 1.2 mm above the board, Top and bottom Contact, Back-Flip actuator

FH39 Seriesq0.3 mm Pitch, 1.2 mm above the board, Top and bottom Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors
sRecommended FPC construction
1. Using Single-sided FPC
FPC : Flexible Printed Circuit
Material Name
Material
Material Thickness
(µm)
Covering film layer
Polyimide 1 mil thick.
(25)
Cover adhesive
(25)
Surface treatment
Copper foil
0.2µm thick gold plated over 1 to 5µm
nickel underplating
3
Cu 1oz
35
Base adhesive
Thermosetting adhesive
25
Base film
Polyimide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
40
Stiffener
Polyimide 3 mil thick
75
Total
203
2. Using Double-sided FPC ^{FPC : Flexible Printed Circuit}
Material Name
Material
Material Thickness
(µm)
Covering film layer
Polyimide 1 mil thick.
(25)
Cover adhesive
Surface treatment
Through-hole copper
0.2µm thick gold plated over 1 to 5µm
nickel underplating
Cu
(25)
3
15
Copper foil
Cu 1/2oz
18
Base adhesive
Thermosetting adhesive
18
Base film
Polyimide 1 mil thick
25
Base adhesive
Copper foil
Thermosetting adhesive
18
Cu 1/2oz
(18)
Cover adhesive
Thermosetting adhesive
25
Covering film layer
Polyimide 1 mil thick.
25
Reinforcement material adhesive Thermosetting adhesive
25
Stiffener
Polyimide 3 mil thick
25
Total
197
* To prevent release of the FPC due to its bending, use of the double sided FPC with copper foil on the back side is NOT RECOMMENDED.
3. Precautions
1: This specification is a recommendation for the construction of the FH39 Series FPC (t=0.2±0.05).
2: For details about the construction, please contact the FPC manufacturers.
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